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HW20-M2 50 High Tg, Low X, Y\/Z Coefficient of Thermal Expansion White Material ◆优异的耐CAF性能 Excellent CAF resistance ◆低X、Y\/Z轴热膨胀系数高Tg(210℃,DMA）Low X,Y\/Z axis thermal expansion coefficient High Tg(210℃,DMA) ◆白色类BT树脂物材料 White BT resin material 产品特性 FEATURES ◆集成电路组件 Integrated circuit components ◆芯片LED基板 Chip LED substrate ◆Mini LED Mini LED 产品应用 APPLICATIONS ◆Specimen thickness: 0.8mmSpecification sheet: 试样厚度：0.8mm IPC-4101E\/126 is for your reference only 规格表：IPC-4101E\/126仅供参考 产品性能GENERAL PROPERTIES V-0 0.03 210 390 ＞60 ＞60 10S\/6 Cycles pass 30 180 2.2 13-15 5-10 0.7 ＜0.3 45KV\/mm 5.8 0.02 ≥1.05N\/mm(1oz) ≥1.05N\/mm(1 oz) - mm ℃ ℃ min min - PPM\/℃ PPM\/℃ % PPM\/℃ PPM\/℃ W\/(m·k） % KV - - UL-94 UL DMA 5% Weight Loss TMA TMA 288℃, Solder dip Before Tg After Tg 50-260℃ Before Tg After Tg ASTM D5470 D-24\/23 D-48\/50+D-0.5\/23 @1GHz @1GHz A 288℃\/10S 耐燃性-Flammability 绝缘层最小厚度\/Minimum thickness 玻璃态转化温度-TG 热分解温度-TD 耐热性-T260 耐热性-T288 热应力-Thermal Stress 导热系数Thermal conductivity 吸水率-Water Absorption 击穿电压-Dielectric Breakdown 介电常数-Permittivity 损耗因子-Loss Tangent 弯曲强度-Flexural Strength 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity A E-24\/125 E-24\/125 LW CW Mpa MΩ-cm MΩ Gpa Gpa 480\/480 ≥103 ≥103 热膨胀系数-CTE (Z-axis) 热膨胀系数-CTEX\/Y-axis CTE 剥离强度-Peel Strength 弹性模数Modulus of elasticity 23 N\/mm 项目 Item 检测方法 IPC-TM-650 单位 Unit 典型值 Typical value

High Tg, Low X,Y\/Z-axis CTE Black Colored BT Laminate for Chip LED Substrates and IC Package HB20-M1 51 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (230℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) ◆IC Package ◆Memory ◆MEMS ◆CSP APPLICATIONS Test item Test condition Unit HB20-M1 UL号\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa Flammability UL-94 - V-0 0.03 ≥230 ＜150 Before Tg PPM\/℃ ＜25 <2.0 11-13 5-10 <0.35 ≥0.8（TOZ） ≥0.8（TOZ） 4.3 0.010 ≥103 480\/480 28 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞390 T288 Thermal Stress 288℃ solder dip - 6 cycles pass Z-axis CTE X\/Y-axis CTE Moisture Absorption Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45KV\/mm Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 Peel Strength Dielectric constant Dissipation Factor Surface resistivity Volume Resistivity E-24\/125 MΩ.cm ≥103 Bending strength(LW\/CW) Young's modulus ＞60

High Tg, Low X,Y\/Z-axis CTE Black Colored BT Laminate for Chip LED Substrates and IC Package HB20-M2 52 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (220℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) ◆IC Package ◆Memory ◆MEMS ◆CSP APPLICATIONS Test item Test condition Unit HB20-M2 UL No. - UL DMA TMA Before Tg 50-260℃ Before Tg D-24\/23 A 288℃\/10s @1GHz @1GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ % N\/mm - - Ω Mpa Gpa Gpa UL燃烧等级\/Flammability UL-94 - V-0 0.03 220 25 2.0 After Tg PPM\/℃ 150 12-14 After Tg PPM\/℃ 5-10 ＜0.3 ≥0.6N\/mm（TOZ） ≥0.6N\/mm（TOZ） 4.5 0.012 ≥103 480\/480 25 绝缘层最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ 390 T288 TMA min ＞60 T260 Thermal Stress 288℃ solder dip - 6 cycles pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 绝缘强度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45KV\/mm Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剥离强度\/Peel Strength 介电常数\/Dielectric constant Dissipation Factor 表面电阻\/Surface resistivity 体积电阻率\/Volume Resistivity E-24\/125 Ω-cm ≥103 Bending strength(LW\/CW) 弯曲模量\/Bending modulus

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI10L 53 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (260℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆IC Package ◆RF ◆Memory ◆MEMS ◆BTC ◆PMIC ◆Module ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) APPLICATIONS Test item Test condition Unit HI10L UL号\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa UL燃烧等级\/Flammability UL-94 - V-0 0.03 ≥260 ＜125 Before Tg PPM\/℃ ＜25 <1.0 9-11 1-4 <0.35 ≥0.8（TOZ） ≥0.8（TOZ） 4.3 0.008 ≥106 490\/510 28 绝缘层最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 绝缘强度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45 Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剥离强度\/Peel Strength 介电常数\/Dielectric constant Dissipation Factor 表面电阻\/Surface resistivity 体积电阻率\/Volume Resistivity E-24\/125 MΩ.cm ≥104 抗弯强度\/Bending strength (LW\/CW) 弯曲模量\/Bending modulus ≥60

High Tg, Halogen Free, Low X,Y\/Z-axis CTE BT Laminate for Chip LED Substrates and IC Package HI07L 54 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (≥300℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity FEATURES GENERAL PROPERTIES ◆FC BGA ◆CPU & GPU ◆FPGA 、ASIC ◆IC Package ◆RF Switch ◆Low Noise Amplifier(LNA) ◆Power Amplifier(PA) APPLICATIONS Test item Test condition Unit HI07L UL No. - UL DMA TMA Before Tg After Tg 50-260℃ Pull Compression D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 E-24\/125 LW CW - mm ℃ min PPM\/℃ PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ MΩ.cm Gpa Gpa UL Flammability UL-94 - V-0 0.03 ≥300 ＞60 ＜25 <100 <1.2 7-9 10-12 ≤0.4 ≥0.8 ≥0.8 4.4 0.008 >1X108 >1X107 32 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE Moisture Absorption Peel Strength Dielectric constant Dissipation Factor Surface resistivity Volume Resistivity Bending modulus

High Tg, Halogen Free, LOW DK GLASS,Low X,Y\/Z-axis CTE BT Laminate for 5G RF and Antenna module HI10L FK 55 ◆Lead-free compatible Halogen free material. ◆BT based material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (270℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in Dk and Df FEATURES GENERAL PROPERTIES ◆IC Substrate（5G RF） ◆IC Substrate（5G Aip） ◆IC Substrate（CPU\/GPU） ◆Optical module APPLICATIONS Test item Test condition Unit HI10L FK UL号\/UL No. - UL DMA TMA Before Tg After Tg Before Tg After Tg D-24\/23 A 288℃\/10s @1GHz @1GHz C-96\/20\/65 A LW CW - - mm ℃ min PPM\/℃ PPM\/℃ PPM\/℃ PPM\/℃ % N\/mm - - Ω Mpa Gpa Gpa UL燃烧等级\/Flammability UL-94 - V-0 0.03 ＞260 ＜30 100-150 ＜11 2-5 ＜0.35 ≥0.7 ≥0.7 3.4 ＜0.003 1X106 370 25 绝缘层最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 TMA min ＞60 T260 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剥离强度\/Peel Strength 介电常数\/Dielectric constant Dissipation Factor 表面电阻\/Surface resistivity 体积电阻率\/Volume Resistivity C-96\/20\/65 Ω-cm 1X106 抗弯强度\/Bending strength (LW\/CW) 杨氏模量\/Young's modulus

High Tg, Halogen Free, Low X,Y\/Z-axis CTE BT Laminate for Chip LED Substrates and IC Package HI07L T 56 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (≥300℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity FEATURES GENERAL PROPERTIES ◆FC BGA ◆CPU & GPU ◆FPGA 、ASIC ◆IC Package ◆RF Switch ◆Low Noise Amplifier(LNA) ◆Power Amplifier(PA) APPLICATIONS Test item Test condition Unit HI07L T UL Flammability UL-94 UL DMA TMA Before Tg After Tg 50-260℃ Pull Compression D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 E-24\/125 LW CW - mm ℃ min PPM\/℃ PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ MΩ.cm Gpa Gpa V-0 - ≥290 ≥60 18 80 0.6 4-7 7-10 ≤0.4 ≥0.8 ≥0.8 4.3±0.2 <0.01 >1X108 >1X107 32 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ≥400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE Moisture Absorption Peel Strength Dielectric constant Dissipation Factor Surface resistivity Volume Resistivity Bending modulus

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI10L K 57 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (260℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆IC Package ◆Memory ◆MEMS ◆CSP ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) APPLICATIONS Test item Test condition Unit HI10L K UL号\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa UL燃烧等级\/Flammability UL-94 - V-0 0.03 ≥260 ＜125 Before Tg PPM\/℃ ＜25 <1.0 9-11 1-4 ＜0.3 ≥0.8（TOZ） ≥0.8（TOZ） 3.4 0.008 ≥106 450\/510 28 绝缘层最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 绝缘强度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45 Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剥离强度\/Peel Strength 介电常数\/Dielectric constant Dissipation Factor 表面电阻\/Surface resistivity 体积电阻率\/Volume Resistivity E-24\/125 MΩ.cm ≥104 抗弯强度\/Bending strength (LW\/CW) 弯曲模量\/Bending modulus ≥60

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI10L T 58 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (260℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆IC Package ◆Memory ◆MEMS ◆CSP ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) APPLICATIONS Test item Test condition Unit HI10L T UL号\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa UL燃烧等级\/Flammability UL-94 - V-0 0.03 ≥260 ＜125 Before Tg PPM\/℃ ＜25 <1.0 7-9 1-4 <0.35 ≥0.8（TOZ） ≥0.8（TOZ） 4.0 0.008 ≥106 490\/520 28 绝缘层最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 绝缘强度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45 Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剥离强度\/Peel Strength 介电常数\/Dielectric constant Dissipation Factor 表面电阻\/Surface resistivity 体积电阻率\/Volume Resistivity E-24\/125 MΩ.cm ≥104 抗弯强度\/Bending strength (LW\/CW) 弯曲模量\/Bending modulus ≥60

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI05L T 59 ◆Lead-free compatible Halogen free material. ◆BT based material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (280℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity FEATURES GENERAL PROPERTIES ◆FC CSP ◆CPU & GPU ◆FPGA 、ASIC ◆IC Package ◆RF Switch ◆Low Noise Amplifier(LNA) ◆Power Amplifier(PA) APPLICATIONS Test item Test condition Unit HI05L T UL号\/UL No. - UL DMA TMA Before Tg After Tg Pull Compression D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 LW CW - mm ℃ min PPM\/℃ PPM\/℃ PPM\/℃ PPM\/℃ % N\/mm - - MΩ Gpa Gpa UL燃烧等级\/Flammability UL-94 - V-0 0.025 ≥280 10-30 20-60 3-5 <10 ≤0.3 ≥0.8 ≥0.8 4.0±0.3 ＜0.008 >1X108 ≥26 绝缘层最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ≥400 T288 ≥30 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 剥离强度\/Peel Strength 介电常数\/Dielectric constant 介电损耗\/Dissipation Factor 表面电阻\/Surface resistivity 体积电阻\/Volume Resistivity E-24\/125 MΩ.cm >1X107 杨氏模量\/Young's modulus LW CW Gpa Gpa 弯曲模量\/Bending modulus ≥30

CBF-018 ◆Lead-free ◆High Tg ◆Low Ra ◆High thickness uniformity ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum hot-press machine Device： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s 3. Leveling stage, 100℃+5kgf+leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 60 High Tg, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 40 μm Typical thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc.. Release film CBF-018 Protect film

CBF-018 GENERAL PROPERTIES PERFORMANCE TEST DATA 61 High Tg, Low Ra, High peel strength Crebest Build-up Film for IC Substrates DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method Typical Value - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) 25\/30\/35\/40\/90 μm Half-curing 100℃@30 min 170℃@30 min 100℃@30 min 180℃@90 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) 113℃ 26 Pa·s 385℃ 180℃ 160℃ 37 ppm\/K 120 ppm\/K 6.0 GPa 94 MPa 5.0% 3.32\/3.39 0.018\/0.018

CBF-018 TGA——Td95% TMA——CTE Desmear performance Peel strength (with Cu) 62 High Tg, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Remark: ◆Any specific requirement could be available upon request. ◆The above data are for your reference only. ◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co., Ltd through Jack Zhang at 15919232997\/jida.zhang@hzccl.com. SPDR——Dk\/Df Number Freq(MHz) Dk Df Number Freq(MHz) Dk Df 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 3.34 3.28 3.36 3.33 3.31 3.32 3.39 3.41 3.35 3.38 3.42 3.39 1 2 3 4 5 Ave. 1 2 3 4 5 Ave. 5 GHz 10 GHz

CBF-013 ◆Lead-free ◆Mid-CTE ◆High Tg ◆Low Ra ◆High thickness uniformity ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum press machine Device： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s 3. Leveling stage, 100℃ + 5 kgf + leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 63 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 40 μm Typical thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc.. Release film CBF-013 Protect film

CBF-013 GENERAL PROPERTIES PERFORMANCE TEST DATA 64 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method Typical Value - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) 25\/30\/35\/40\/ μm Half-curing 100℃@30 min 180℃@30 min 100℃@30 min 180℃@90 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) 100℃ 14 Pa·s 385℃ 175℃ 160℃ 29 ppm\/K 110 ppm\/K 9.0 GPa 107 MPa 3% 3.35\/3.35 0.015\/0.015 CBF-013

CBF-013 TGA——Td95% TMA——CTE Desmear performance SPDR——Dk\/Df Peel strength (with Cu) 65 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Number Freq(MHz) Dk Df 10 GHz Number Freq(MHz) Dk Df 1 2 3 4 5 Ave. 1 2 3 4 5 Ave. 3.32 3.37 3.37 3.35 3.33 3.35 3.35 3.37 3.35 3.34 3.34 3.35 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 5 GHz Remark: ◆Any specific requirement could be available upon request. ◆The above data are for your reference only. ◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co., Ltd through Jack Zhang at 15919232997\/jida.zhang@hzccl.com.

CBF-014A ◆Lead-free ◆Mid-CTE ◆High Tg ◆Low Ra ◆Good thickness uniformity ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum press machine Equipment： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 105℃+5kgf+vacuum 60s 3. Leveling stage, 105℃+5kgf+leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 66 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 40 μm 90 μm Typical thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc. Release film CBF-014A Protect film

CBF-014A GENERAL PROPERTIES PERFORMANCE TEST DATA 67 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Thermal conductivity Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method Typical Value - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) Water absorption - < 0.5% 388℃ 175℃ 165℃ 29 ppm\/K 110 ppm\/K 25\/30\/35\/40\/90 μm Half-curing 100℃@30 min 180℃@30 min 100℃@30 min 180℃@60 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) ASTM D5470-17 (Longwin, LW9389 TIM) 0.5 W\/(mK) Flame retardant UL 94V standard V0 7.5 GPa 84 MPa 3.1% Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) Breakdown strength (DC\/AC) programmable withstanding voltage tester (CS9917CX, Allwin Instrument) 105℃ 37.5 μm, ~10 kV\/ ~7 kV 3.28\/3.28 0.012\/0.012 21 Pa·s

CBF-014A TGA——Td95% TMA——CTE Desmear performance Breakdown strength SPDR——Dk\/Df Peel strength (with Cu) 68 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Number Freq(MHz) Dk Df Number Freq(MHz) Dk Df 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 3.26 3.29 3.27 3.30 3.27 3.28 3.22 3.23 3.32 3.33 3.32 3.28 1 2 3 4 5 Ave. 1 2 3 4 5 Ave. 5 GHz 10 GHz Remark: ◆Any specific require could be available upon request. ◆The above data is for your reference only. ◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co. Ltd (深圳中科华正半导体材料有限公司) through Jack Zhang at 15919232997\/jida.zhang@hzc cl.com.

CBF-004 ◆Lead-free ◆Low CTE ◆High Tg ◆Low Ra ◆Low dielectric loss ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum press machine Device： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s 3. Leveling stage, 100℃ + 5 kgf + leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 69 Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 90 μm Thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc.. Release film CBF-004 Protect film

CBF-004 GENERAL PROPERTIES PERFORMANCE TEST DATA 70 DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method CBF-004 - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) 25\/30\/35\/40\/90 μm Semi-curing 130℃@30 min 180℃@30 min 130℃@30 min 190℃@90 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) 130℃ 200 Pa·s 390℃ 180℃ 160℃ 20 ppm\/K 80 ppm\/K 12 GPa 90 MPa 1.5% 3.3\/3.4 0.0045\/0.0045 Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates

CBF-004 TGA——Td95% TMA——CTE Desmear performance SPDR——Dk\/Df Peel strength (with Cu) 71 Number Freq(MHz) Thickness(mm) Dk Df 0.005376 0.005103 0.005028 0.005118 0.005171 0.0052 3.216034 3.347095 3.225112 3.276175 3.272771 3.27 1 2 3 4 5 Ave. 0.035 0.035 0.035 0.035 0.035 0.035 5 GHz Remark: ◆Any specific require could be available upon request. ◆The above data is for your reference only. ◆Please contact Shenzhen CREBEST Electronic Materials Co., Ltd if need more Lami- nates. Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates

H175HF FR-4.1 High Tg, Halogen Free & Mid Loss Material ◆耐CAF能力 CAF resistance performance ◆符合Mid-loss材料插损需求 Suitable for Mid-loss insertion requirements ◆优良的可靠性 Excellent Reliability 产品特性 FEATURES ◆服务器、交换机、基站、电脑周边设备 Server, Switch, Base station, Computer peripherals 产品应用 APPLICATIONS 72 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 168 205 34 193 2.1 \/ 4.70*1010 3.54*10 8 130 60 - 550 450 0.12 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.42 SPDR method 10GHz C-24\/23\/50 4.30 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 18-20 N\/mm 0.85 1.15 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC50%) 介质损耗 Df-Loss Tangent (RC50%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0105 SPDR method 10GHz C-24\/23\/50 0.0120 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H175HFZ FR-4.1 Halogen-free, High Reliability& Mid Loss Material ◆耐CAF能力 CAF resistance performance ◆符合Mid-loss材料插损需求 Suitable for Mid- loss insertion requirements ◆优良的可靠性 Excellent Reliability ◆更低的Z轴热膨胀系数 Lower Z-axis CTE 产品特性 FEATURES ◆服务器、交换机、基站、线卡 Server,Switch, Base station ,Line cards ◆厚铜电源 Power supplier and Heavy Copper ◆EV,PEV,HEV,OBC,MDC汽车电子元器件 EV,PEV,HEV,OBC,MDC Automotive electronic components 产品应用 APPLICATIONS 73 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 180 184 210 33 194 1.8 \/ 4.70*1010 3.54*10 8 130 60 \/ 550 450 0.10 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.3 SPDR method 10GHz C-24\/23\/50 4.2 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12.5 N\/mm 0.85 1.15 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC50%) 介质损耗 Df-Loss Tangent (RC50%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0091 SPDR method 10GHz C-24\/23\/50 0.0100 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H180HF 74 FR-4.1 Halogen Free, Low Loss & High Reliability Material ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent CAF resistance performance ◆较低的Dk\/Df Lower Dk\/Df ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability 产品特性 FEATURES 产品性能GENERAL PROPERTIES ◆服务器、交换机、基站 Server, Switch, Base station ◆背板、线卡 Backplane, Line cards ◆商用路由器 Office Routers 产品应用 APPLICATIONS ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 180 175 210 35 200 2.2 \/ 4.13 4.13*109 2.52*108 65 \/ 630 520 0.12 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.09 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12 N\/mm 0.70 1.00 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC50%) 介质损耗 Df-Loss Tangent (RC50%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.005 SPDR method 10GHz C-24\/23\/50 0.007 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H185HFL 75 Low Loss & Low CTE & Halogen Free 产品特性 FEATURES 产品性能GENERAL PROPERTIES 产品应用 APPLICATIONS ◆适用于高可靠性、优异CAF表现求应用场景 For high-reliability and excellent CAF performance applications ◆X\/Y\/Z 三轴低热膨胀系数（CTE） Low CTE for X\/ Y\/ Z-axis direction ◆更低的损耗 Low Df for excellent electrical performance ◆符合 RoHS 环保标准 RoHS Compliant ◆汽车及功率能源模Automotive and power energy modules ◆移动设备 Mobile device ◆高速服务器 High-speed server ◆网络及电信设备 Network and telecom ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 190 230 270 26 130 1.25 \/ ＞1010 ＞109 180 30 \/ 24-26 23-26 0.10 430 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.0 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >60 2.4.24.5 ＜Tg，TMA ppm\/℃ 10 N\/mm 0.8 1.1 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC50%) 介质损耗 Df-Loss Tangent (RC50%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.005 SPDR method 10GHz C-24\/23\/50 0.007 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H190HF 76 FR4.1 Halogen Free, Very Low Loss & High Reliability Material ◆较低的Dk\/Df Lower Dk\/Df ◆更优异的耐热性 High heat resistance ◆更低的Z轴热膨胀系数 Lower Z-axis CTE ◆更低的吸水率 Lower moisture absorption 产品特性 FEATURES 产品性能GENERAL PROPERTIES ◆超高速网络设备 High Speed Network equipment ◆服务器、交换机、存储、路由器 Server, Switch, Storage and Routers ◆光通讯产品等 Optical Modulus, etc. 产品应用 APPLICATIONS ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 185 200 42 209 1.8 \/ 4.81*109 2.72*108 135 65 \/ 535 485 0.12 395 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.07 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 13 N\/mm 0.60 0.75 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC50%) 介质损耗 Df-Loss Tangent (RC50%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0034 SPDR method 10GHz C-24\/23\/50 0.0055 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H360 77 Very Low Loss & Heat Resistance Material ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆较低的Dk\/Df Lower Dk\/Df ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability 产品特性 FEATURES 产品性能GENERAL PROPERTIES ◆超高速网络设备 Ultra high speed network equipment ◆服务器、交换机、存储 Server, Switch, Storage ◆高性能计算机 High performance computing ◆光通信产品 Optical communication products 产品应用 APPLICATIONS ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 180 208 40 258 2.5 \/ 2.21*109 1.56*108 125 58 0.55 420 380 0.11 395 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.72 SPDR method 10GHz C-24\/23\/50 3.65 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 13 N\/mm 0.60 0.75 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC54%) 介质损耗 Df-Loss Tangent (RC54%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0023 SPDR method 10GHz C-24\/23\/50 0.0048 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H360(Z) 78 Very Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆较低的Dk\/Df Lower Dk\/Df 产品特性 FEATURES ◆服务器、交换机、存储 Server, Switch, Storage ◆高性能计算机 High performance computing ◆光通信产品 Optical communication products 产品应用 APPLICATIONS 9 8 ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 190 215 35 203 2.0 \/ 2.21*109 1.56*108 120 60 0.65 525 485 0.08 408 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.71 SPDR method 10GHz C-24\/23\/50 3.65 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 10 N\/mm 0.65 0.75 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC56%) 介质损耗 Df-Loss Tangent (RC56%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0031 SPDR method 10GHz C-24\/23\/50 0.0045 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H350 79 Ultra Low Loss & Heat Resistance Material ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆较低的Dk\/Df Lower Dk\/Df ◆更低的热膨胀系数 Lower CTE 产品特性 FEATURES ◆超高速网络设备 Ultra high speed network equipment ◆服务器、交换机、存储 Server, Switch, Storage ◆高性能计算机 High performance computing ◆光通信产品 Optical communication products 产品应用 APPLICATIONS 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 185 207 40 180 2.0 \/ 1.0*109 1.0*108 120 62 0.60 500 480 0.08 403 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.90 SPDR method 10GHz C-24\/23\/50 3.70 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 7 N\/mm 0.56 0.65 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC55%) 介质损耗 Df-Loss Tangent (RC55%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0037 SPDR method 10GHz C-24\/23\/50 0.0042 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

H350(K) 80 Ultra Low Loss & Heat Resistance Material 产品特性 FEATURES 产品应用 APPLICATIONS ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆较低的Dk\/Df Lower Dk\/Df ◆更低的热膨胀系数 Lower CTE ◆超高速网络设备 Ultra high speed network equipment ◆服务器、交换机、存储 Server, Switch, Storage ◆高性能计算机 High performance computing ◆光通信产品 Optical communication products 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 185 207 40 180 2.0 \/ 1.0*109 1.0*108 120 62 0.60 500 480 0.08 403 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.44 SPDR method 10GHz C-24\/23\/50 3.42 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 7 N\/mm 0.56 0.65 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC58%) 介质损耗 Df-Loss Tangent (RC58%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0017 SPDR method 10GHz C-24\/23\/50 0.0021 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD7 Ultra Low Loss & Heat Resistance Material 产品特性 FEATURES 产品性能GENERAL PROPERTIES 产品应用 APPLICATIONS 81 ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆较低的Dk\/Df Lower Dk\/Df ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆超高速网络设备 Ultra high speed network equipment ◆服务器、交换机、存储 Server, Switch, Storage ◆高性能计算机 High performance computing ◆光通信产品 Optical communication products ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 195 220 45 230 2.3 \/ 1.0*109 1.0*108 120 62 0.65 420 390 0.08 405 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.54 SPDR method 10GHz C-24\/23\/50 3.53 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12.3 N\/mm 0.70 0.65 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC59%) 介质损耗 Df-Loss Tangent (RC59%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0031 SPDR method 10GHz C-24\/23\/50 0.0035 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD7(K) Ultra Low Loss & Heat Resistance Material 产品特性 FEATURES 产品性能GENERAL PROPERTIES 产品应用 APPLICATIONS 82 ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆较低的Dk\/Df Lower Dk\/Df ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆超高速网络设备 Ultra high speed network equipment ◆交换机、路由器、存储 Switch, Routers, Storage ◆高性能计算机、AI计算 High performance co- mputing、AI computing ◆光通信产品 Optical communication products ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 195 220 45 230 2.3 \/ 1.0*109 1.0*108 120 62 0.65 420 390 0.08 405 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.32 SPDR method 10GHz C-24\/23\/50 3.30 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 11.9 N\/mm 0.70 0.65 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC61%) 介质损耗 Df-Loss Tangent (RC61%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0019 SPDR method 10GHz C-24\/23\/50 0.0023 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD7JA(K) Ultra Low Loss & Heat Resistance Material 产品特性 FEATURES 产品性能GENERAL PROPERTIES 产品应用 APPLICATIONS 83 ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆较低的Dk\/Df Lower Dk\/Df ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆超高速网络设备 Ultra high speed network equipment ◆交换机、路由器、存储 Switch, Routers, Storage ◆高性能计算机、AI计算 High performance co- mputing、AI computing ◆光通信产品 Optical communication products ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 195 217 45 240 2.5 \/ 1.0*109 1.0*108 120 ＞50 0.71 380 360 0.06 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.17 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12.5 N\/mm 0.60 0.65 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC68%) 介质损耗 Df-Loss Tangent (RC68%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0018 SPDR method 10GHz C-24\/23\/50 0.0019 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD7LG Halogen-free Ultra-low Loss & Heat Resistance Material 产品特性 FEATURES 产品性能GENERAL PROPERTIES 产品应用 APPLICATIONS 84 ◆较低的Dk\/Df Lower Dk\/Df ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆AI服务器、交换机、存储、路由器 AI Server, switch, storage, routers ◆光通信产品 Optical communication products ◆AI计算、AI服务器 AI computing、AI Server ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 225 31 200 1.8 \/ 1.0*1010 1.0*108 120 ＞50 0.54 420 380 0.07 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.93 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 10.1 N\/mm 0.69 0.75 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC53%) 介质损耗 Df-Loss Tangent (RC53%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0037 SPDR method 10GHz C-24\/23\/50 0.0044 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD7LG(K) Halogen-free Ultra-low Loss & Heat Resistance Material 产品特性 FEATURES 产品性能GENERAL PROPERTIES 产品应用 APPLICATIONS 85 ◆较低的Dk\/Df Lower Dk\/Df ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆交换机、存储、路由器 Switch, storage, routers ◆光通信产品 Optical communication products ◆AI计算、AI服务器 AI computing、AI Server ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 225 31 200 1.8 \/ 1.0*1010 1.0*108 120 ＞50 0.54 420 380 0.07 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.40 SPDR method 10GHz C-24\/23\/50 3.37 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.1 N\/mm 0.69 0.75 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC55%) 介质损耗 Df-Loss Tangent (RC55%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0021 SPDR method 10GHz C-24\/23\/50 0.0025 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD8(K) 86 ◆更低的损耗 Extreme Low Loss ◆优异的耐热性 Excellent thermal resistance ◆更低的Z轴热膨胀系数 Low Z axis CTE ◆更低的吸水率、优秀的耐CAF性能、优异的可靠性 Low water absorption, excellent anti-CAF, high reliability 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 199 226 38 145 1.5 \/ 4.93*109 3.72*108 135 65 0.55 384 350 0.10 406 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.31 SPDR method 10GHz C-24\/23\/50 3.25 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.6 N\/mm 0.55 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC68%) 介质损耗 Df-Loss Tangent (RC68%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0011 SPDR method 10GHz C-24\/23\/50 0.0014 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD8 87 ◆更低的损耗 Extreme Low Loss ◆优异的耐热性 Excellent thermal resistance ◆更低的Z轴热膨胀系数 Low Z axis CTE ◆更低的吸水率、优秀的耐CAF性能、优异的可靠性 Low water absorption, excellent anti-CAF, high reliability 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 199 226 38 145 1.5 \/ 4.93*109 3.72*108 135 65 0.55 384 350 0.10 406 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.12 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.5 N\/mm 0.55 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC69%) 介质损耗 Df-Loss Tangent (RC69%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0012 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD8(C) 88 ◆低介电常数、介质损耗 Low Dk、Df ◆优异的耐热性 Excellent thermal resistance ◆更低的Z轴热膨胀系数 Low Z axis CTE ◆较低的吸水率、耐CAF性能好、高可靠性 Low water absorption, excellent anti-CAF, high reliability ◆无铅制程兼容 Compatible with Lead-free process 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 199 216 38 165 1.5 \/ 4.93*109 3.72*108 135 65 0.55 455 425 0.10 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.15 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.5 N\/mm 0.55 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC68%) 介质损耗 Df-Loss Tangent (RC68%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0012 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD8LG K 89 ◆更低的损耗、更低的热膨胀系数 Extreme Low Loss、Lower CTE ◆优异的耐热性、无卤素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、优秀的耐CAF性能、优异的可靠性 Low water absorption, excellent anti-CAF, high reliability 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 198 226 45 145 1.5 \/ 4.95*109 4.72*108 135 65 0.65 355 345 0.10 409 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.31 SPDR method 10GHz C-24\/23\/50 3.25 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 4.8 N\/mm 0.60 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC64%) 介质损耗 Df-Loss Tangent (RC64%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0012 SPDR method 10GHz C-24\/23\/50 0.0015 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD8LG K2 90 ◆更低的损耗 Extreme Low Loss ◆优异的耐热性 Excellent thermal resistance ◆更低的热膨胀系数 Lower CTE ◆更低的吸水率、优秀的耐CAF性能、优异的可靠性 Low water absorption, excellent anti-CAF, high reliability ◆无卤素成分 Halogen Free 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 223 45 140 1.8 \/ 4.95*109 4.72*108 135 65 0.65 360 350 0.10 408 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.15 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 4.6 N\/mm 0.60 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC66%) 介质损耗 Df-Loss Tangent (RC66%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0010 SPDR method 10GHz C-24\/23\/50 0.0013 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD8LG Q 91 ◆更低的损耗、更低的热膨胀系数 Extreme Low Loss、Lower CTE ◆优异的耐热性、无卤素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、优秀的耐CAF性能、优异的可靠性 Low water absorption, excellent anti-CAF, high reliability 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 221 40 145 1.5 \/ 4.90*109 4.82*108 135 65 0.65 365 355 0.10 408 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.14 SPDR method 10GHz C-24\/23\/50 3.09 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 3.1 N\/mm 0.60 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC65%) 介质损耗 Df-Loss Tangent (RC65%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0011 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD9LG Q 92 ◆更低的损耗、更低的热膨胀系数 Extreme Low Loss、Lower CTE ◆优异的耐热性、无卤素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、优秀的耐CAF性能、优异的可靠性 Low water absorption, excellent anti-CAF, high reliability 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 190 221 45 140 1.6 \/ 4.17*109 3.45*108 135 65 0.55 310 315 0.10 400 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.06 SPDR method 10GHz C-24\/23\/50 3.05 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 5.5 N\/mm 0.60 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC70%) 介质损耗 Df-Loss Tangent (RC70%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.00062 SPDR method 10GHz C-24\/23\/50 0.00065 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD9LG K2 93 ◆更低的损耗、更低的热膨胀系数 Extreme Low Loss、Lower CTE ◆优异的耐热性、无卤素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、优秀的耐CAF性能、优异的可靠性 Low water absorption, excellent anti-CAF, high reliability 产品特性 FEATURES ◆交换机、服务器 Switch, Server ◆路由器、AI计算 Router、AI computing ◆测量仪器 Measuring instrument 产品应用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 190 221 45 140 1.6 \/ 4.17*109 3.45*108 135 65 0.55 310 315 0.10 400 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.20 SPDR method 10GHz C-24\/23\/50 3.16 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 6.2 N\/mm 0.60 0.60 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC70%) 介质损耗 Df-Loss Tangent (RC70%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0011 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

HSD6LG 94 Halogen-free Ultra-low Loss & Heat Resistance Material 产品特性 FEATURES 产品应用 APPLICATIONS ◆较低的Dk\/Df Lower Dk\/Df ◆优异的耐热性 Excellent thermal reliability ◆优秀的耐CAF性能 Excellent anti-CAF performance ◆更低的Z轴热膨胀系数、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆服务器、交换机、存储、路由器 Server, switch, storage, routers ◆汽车毫米波雷达 Millimeter wave radar for Automotive ◆高性能计算机 High performance computing 产品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 225 43 240 2.2 \/ 1*1010 1*108 120 ＞50 0.55 420 380 0.07 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.66 SPDR method 10GHz C-24\/23\/50 3.92 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 10 N\/mm 0.54 0.55 2.4.8 1 oz As received 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value 耐热性-T288 热应力-Thermal Stress 热膨胀系数-CTE (Z-axis) 介电常数 Dk-Permittivity(RC62%) 介质损耗 Df-Loss Tangent (RC62%) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 耐电弧性-Arc Resistance 击穿电压-Dielectric Breakdown 相对漏电起痕指数-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 热分解温度-TD (Decomposition Temperature) 弯曲强度Flexural Strength Warp Fill 玻璃态转化温度-TG 热膨胀系数-CTE (XY-axis) 项目 Item 剥离强度(HTE)-Peel Strength 剥离强度(RTF)-Peel Strength 剥离强度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0033 SPDR method 10GHz C-24\/23\/50 0.0045 热性能 Thermal 电性能 Electrical 物理性能 Physical 属性 Property

PTFE with Glass Reinforced RF Circuit Material H5220 95 ◆Dk\/Df在不同频率和温度下保持稳定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低损耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性价比 Excellent Price Performance Value 产品特性 FEATURES 产品性能GENERAL PROPERTIES ◆基站天线 Base Station Antennas ◆卫星通讯 Satellite Communications ◆滤波器、耦合器、低噪声放大器 Filers, Couplers, LNAs ◆功率放大器 Power Amplifiers ◆相控阵天线 Phased Array Antennas ◆航空电子和航空航天 Avionics and Aerospace 产品应用 APPLICATIONS 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50, E-24\/125 介电常数-Dk 介质损耗-Df 热膨胀系数-CTE (X) 热膨胀系数-CTE (Y) 热膨胀系数-CTE (Z) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 导热系数-Thermal Conductivity 吸水率-Water Absorption 热分解温度-TD 剥离强度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.20+\/-0.04 0.0009 20 20 220 108 108 0.27 <0.1 >500 ≥1.2 V0 产品规格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常规尺寸 Standard Panel Size 标配铜箔 Standard Copper Foil 0.020\"(0.508mm) ±0.002\" 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 项目 Item 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value

PTFE with Glass Reinforced RF Circuit Material H5255 96 ◆Dk\/Df在不同频率和温度下保持稳定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低损耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性价比 Excellent Price Performance Value 产品特性 FEATURES ◆基站天线 Base Station Antennas ◆卫星通讯 Satellite Communications ◆滤波器、耦合器、低噪声放大器 Filers, Couplers, LNAs ◆功率放大器 Power Amplifiers ◆相控阵天线 Phased Array Antennas ◆航空电子和航空航天 Avionics and Aerospace 产品应用 APPLICATIONS 产品性能GENERAL PROPERTIES 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介电常数-Dk 介质损耗-Df 热膨胀系数-CTE (X) 热膨胀系数-CTE (Y) 热膨胀系数-CTE (Z) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 导热系数-Thermal Conductivity 吸水率-Water Absorption 热分解温度-TD 剥离强度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.55+\/-0.05 0.0018 15 15 200 108 108 0.27 <0.1 >500 ≥1.2 V0 产品规格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常规尺寸 Standard Panel Size 标配铜箔 Standard Copper Foil 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 项目 Item 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value

PTFE with Glass Reinforced RF Circuit Material H5265 97 产品性能GENERAL PROPERTIES 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介电常数-Dk 介质损耗-Df 热膨胀系数-CTE (X) 热膨胀系数-CTE (Y) 热膨胀系数-CTE (Z) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 导热系数-Thermal Conductivity 吸水率-Water Absorption 热分解温度-TD 剥离强度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.65+\/-0.05 0.0018 16 16 160 108 108 0.30 <0.1 >500 ≥1.2 V0 产品规格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常规尺寸 Standard Panel Size 标配铜箔 Standard Copper Foil 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 项目 Item 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value ◆Dk\/Df在不同频率和温度下保持稳定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低损耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性价比 Excellent Price Performance Value 产品特性 FEATURES ◆基站天线 Base Station Antennas ◆卫星通讯 Satellite Communications ◆滤波器、耦合器、低噪声放大器 Filers, Couplers, LNAs ◆功率放大器 Power Amplifiers ◆相控阵天线 Phased Array Antennas ◆航空电子和航空航天 Avionics and Aerospace 产品应用 APPLICATIONS

PTFE with Glass Reinforced RF Circuit Material H5300H 98 产品性能GENERAL PROPERTIES 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介电常数-Dk 介质损耗-Df 热膨胀系数-CTE (X) 热膨胀系数-CTE (Y) 热膨胀系数-CTE (Z) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 导热系数-Thermal Conductivity 吸水率-Water Absorption 热分解温度-TD 剥离强度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.98+\/-0.05 0.0020 14 14 80 108 108 0.30 <0.15 >500 ≥1.20 V0 产品规格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常规尺寸 Standard Panel Size 标配铜箔 Standard Copper Foil 0.020\"(0.508mm) ±0.002\" 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 项目 Item 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value ◆Dk\/Df在不同频率和温度下保持稳定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低损耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性价比 Excellent Price Performance Value 产品特性 FEATURES ◆基站天线 Base Station Antennas ◆卫星通讯 Satellite Communications ◆天线馈电网络 Antenna Feed Networks ◆DAS & CPE 天线 DAS & CPE Antenna ◆射频无源元件 RF Passive Components 产品应用 APPLICATIONS

PTFE with Glass Reinforced RF Circuit Material H5300S 99 ◆Dk\/Df在不同频率和温度下保持稳定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低损耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性价比 Excellent Price Performance Value 产品特性 FEATURES ◆基站天线 Base Station Antennas ◆卫星通讯 Satellite Communications ◆天线馈电网络 Antenna Feed Networks ◆DAS & CPE 天线 DAS & CPE Antenna ◆射频无源元件 RF Passive Components 产品应用 APPLICATIONS 产品性能GENERAL PROPERTIES 产品规格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常规尺寸 Standard Panel Size 标配铜箔 Standard Copper Foil 0.0051\"(0.130mm)±0.0007\" 0.0094\"(0.239mm)±0.0007\" 0.020\"(0.508mm) ±0.001\" 0.030\"(0.762mm) ±0.001\" 0.040\"(1.016mm) ±0.002\" 0.050\"(1.270mm) ±0.003\" 0.060\"(1.524mm) ±0.004\" 2.79 2.89 2.92 2.94 2.94 2.97 2.98 36\"*48\" (914mm×1219mm) 18\"*24\" (457mm×610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 可选埋阻铜箔 介电常数 DK 10GHz\/23℃ 10GHz\/23℃ 10GHz (-40-150℃) CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介电常数-Dk 介质损耗-Df 温漂-TCDK 热膨胀系数-CTE (X) 热膨胀系数-CTE (Y) 热膨胀系数-CTE (Z) 体积电阻-Volume Resistivity 表面电阻-Surface Resistivity 导热系数-Thermal Conductivity 吸水率-Water Absorption 热分解温度-TD 剥离强度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.94+\/-0.05 0.0012 -9 8 8 20 108 108 0.55 <0.2 >500 ≥0.80 V0 项目 Item 检测方法 IPC-TM-650 测试条件 Test Condition 单位 Unit 典型值 Typical value

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