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High Thermal Conductive RF PCB Used Laminate Material<br>H5350P<br>100<br>◆含陶瓷填充之玻纤增强PTFE材料 Glass-reinforced PTFE and<br> ceramic dielectric<br>◆优异的射频性能 Excellent high frequency performance<br>◆优异的导热性能 Enhanced thermal conductivity<br>◆在不同频段下具有稳定的介电性能 Stable electrical properties<br> versus frequency<br>◆低Z轴CTE及优异的尺寸稳定性 Low Z-axis expansion and<br> excellent dimensional stability<br>◆兼容无铅制程 Compatible with lead-free process<br>产品特性 FEATURES<br>◆无源器件 Passive Components<br>◆功率放大器 Power Amplifiers<br>◆微波合成器和功率分配器 Microwave<br> Combiner and Power Dividers<br>◆LNA\/LNB<br>产品应用 APPLICATIONS<br>产品性能GENERAL PROPERTIES<br>10GHz\/23℃<br>10GHz\/23℃<br>10GHz (-40-150℃)<br>CTE (30-260℃)<br>CTE (30-260℃)<br>CTE (30-260℃)<br>C-96\/35\/90<br>C-96\/35\/90<br>100℃<br>D-24\/23<br>-<br>C-48\/23\/50<br>C-48\/23\/50<br>介电常数-Dk<br>介质损耗-Df<br>温漂-TCDK<br>热膨胀系数-CTE (X)<br>热膨胀系数-CTE (Y)<br>热膨胀系数-CTE (Z)<br>体积电阻-Volume Resistivity<br>表面电阻-Surface Resistivity<br>导热系数-Thermal Conductivity<br>吸水率-Water Absorption<br>热分解温度-TD<br>剥离强度-Peel strength<br>(Hoz Cu)<br>耐燃性-Flammability<br>2.5.5.5<br>2.5.5.5<br>2.5.5.5<br>2.4.24C<br>2.4.24C<br>2.4.24C<br>2.5.17.1<br>2.5.17.1<br>ASTM-D5470<br>2.6.2.1A<br>2.4.24.6<br>2.4.8<br>UL94<br>\/<br>\/<br>ppm \/ ℃<br>ppm \/ ℃<br>ppm \/ ℃<br>ppm \/ ℃<br>MΩ·cm<br>MΩ<br>W\/m·K<br>%<br>℃<br>N\/mm<br>\/<br>3.56+\/-0.05<br>0.0020<br>35<br>10<br>10<br>38<br>106<br>106<br>≥1.2<br><0.2<br>>500<br>≥0.52<br>V0<br>产品规格PRODUCT SPECIFICATIONS<br>厚度<br>Standard Thickness<br>常规尺寸<br>Standard Panel Size<br>标配铜箔<br>Standard Copper Foil<br>0.005\"(0.127mm) ±0.001\"<br>0.020\"(0.508mm) ±0.001\"<br>0.030\"(0.762mm) ±0.002\"<br>41\"*49\" (1041mmx1245mm)<br>36\"*48\" (914mmx1219mm)<br>18\"*24\" (457mmx610mm)<br>1\/2 OZ (17μm)<br>1 OZ (35μm)<br>项目<br>Item<br>检测方法<br>IPC-TM-650<br>测试条件<br>Test Condition<br>单位<br>Unit<br>典型值<br>Typical value

Thermal Conductive RF PCB Used Laminate Material<br>H5350T<br>101<br>◆含陶瓷填充之玻纤增强PTFE材料 Glass-reinforced PTFE and<br> ceramic dielectric<br>◆优异的射频性能 Excellent high frequency performance<br>◆优异的导热性能 Enhanced thermal conductivity<br>◆在不同频段下具有稳定的介电性能 Stable electrical properties<br> versus frequency<br>◆低Z轴CTE及优异的尺寸稳定性 Low Z-axis expansion and<br> excellent dimensional stability<br>◆兼容无铅制程 Compatible with lead-free process<br>产品特性 FEATURES<br>◆无源器件 Passive Components<br>◆功率放大器 Power Amplifiers<br>◆微波合成器和功率分配器 Microwave<br> Combiner and Power Dividers<br>◆LNA\/LNB<br>产品应用 APPLICATIONS<br>产品性能GENERAL PROPERTIES<br>10GHz\/23℃<br>10GHz\/23℃<br>CTE (30-260℃)<br>CTE (30-260℃)<br>CTE (30-260℃)<br>C-96\/35\/90<br>C-96\/35\/90<br>100℃<br>D-24\/23<br>-<br>C-48\/23\/50<br>C-48\/23\/50<br>介电常数-Dk<br>介质损耗-Df<br>热膨胀系数-CTE (X)<br>热膨胀系数-CTE (Y)<br>热膨胀系数-CTE (Z)<br>体积电阻-Volume Resistivity<br>表面电阻-Surface Resistivity<br>导热系数-Thermal Conductivity<br>吸水率-Water Absorption<br>热分解温度-TD<br>剥离强度-Peel strength<br>(Hoz Cu)<br>耐燃性-Flammability<br>2.5.5.5<br>2.5.5.5<br>2.4.24C<br>2.4.24C<br>2.4.24C<br>2.5.17.1<br>2.5.17.1<br>ASTM-D5470<br>2.6.2.1A<br>2.4.24.6<br>2.4.8<br>UL94<br>\/<br>\/<br>ppm \/ ℃<br>ppm \/ ℃<br>ppm \/ ℃<br>MΩ·cm<br>MΩ<br>W\/m·K<br>%<br>℃<br>N\/mm<br>\/<br>3.53+\/-0.05<br>0.0025<br>10<br>10<br>35<br>106<br>106<br>≥0.7<br><0.2<br>>500<br>0.70<br>V0<br>产品规格PRODUCT SPECIFICATIONS<br>厚度<br>Standard Thickness<br>常规尺寸<br>Standard Panel Size<br>标配铜箔<br>Standard Copper Foil<br>0.020\"(0.508mm) ±0.002\"<br>0.030\"(0.762mm) ±0.002\"<br>41\"*49\" (1041mmx1245mm)<br>36\"*48\" (914mmx1219mm)<br>18\"*24\" (457mmx610mm)<br>1\/2 OZ (17μm)<br>1 OZ (35μm)<br>项目<br>Item<br>检测方法<br>IPC-TM-650<br>测试条件<br>Test Condition<br>单位<br>Unit<br>典型值<br>Typical value